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Medical-grade Nitrogen has several important applications in the healthcare industry, including:

• Cryopreservation: Nitrogen is used in cryogenic storage systems for preserving biological samples, cells, tissues, and reproductive materials at ultra-low temperatures. This enables long-term storage while maintaining their viability and quality.
• Surgical Procedures: Nitrogen is used in various surgical procedures to create a controlled and dry surgical field. It can be utilized for freezing tissues, such as during cryosurgery or dermatological procedures, to remove or destroy abnormal cells.
• Respiratory Support: Nitrogen is used in respiratory therapy to deliver a dry and non-humidified gas stream. This can be beneficial for patients with specific respiratory conditions that require precise control of humidity levels, such as those with certain lung diseases.
• Laser Surgery: Nitrogen is used as a cryogen in certain laser surgeries to cool and protect the surrounding tissues from thermal damage. It helps maintain a safe operating environment during laser procedures.
• Calibration and Testing: Nitrogen is used in the calibration and testing of medical devices, such as pressure gauges, flow meters, and anesthesia machines. It provides a clean and inert gas source for accurate measurements and device performance verification.
• Laboratory and Research: Nitrogen is widely used in laboratory and research settings for various applications, including sample storage, inert gas environments, and purging or blanketing of sensitive materials.

These are just a few examples of the many applications of medical Nitrogen in the healthcare industry. Its inert properties, low reactivity, and dry nature make it a valuable gas for various medical procedures and treatments.

Reflow Furnace

The function of the reflow furnace is to provide an evenly heated atmosphere to allow for the deposited solder paste to reflow (melt) to allow for connection of the SMT components to the printed circuit board. Convective heating is the most widely used method to provide for this heated atmosphere. Air or nitrogen can be used; however nitrogen is preferred to achieve lower soldering defects.

The reflow process of BGA and CSP components under a nitrogen (reduced oxygen) environment while using a low activity resin-based paste demonstrated better wetting performance than under an air reflow environment. Nitrogen reflow prevented the formation of new oxides, while avoiding the use of solder pastes with high fluxing capacity, providing improved wetting performance, fewer HIP defects, and improved quality and cleanliness of the solder joints, as compared to a conventional air reflow process.

Material Safety Data Sheet

Refer to IOL Material Safety Data Sheet for further information on product handling, storage and usage.